...not a bad approach. I think it is important to point out that the function of both thermal grease and adhesive is to fill the air pocket formed between the chip and the sink (from a cooling perspective). The adhesive allows relatively easy mounting of the sink to the chip. The materials that are typically used in thermal adhesives are epoxy resins which have excellent gap filling characteristics (again, giving you something other than air to conduct heat - air is an extremely poor conductor of heat). Lately, I have been experimenting a bit with thickened cyanoacrylate adhesives (Superglue for porour stuff). I have not had the opportunity to put thermocouples to determine performance differences but, the thickened cyanoacrylates seem to perform well. The advantage of these adhesives over epoxies is that they are easily dissolved with acetone. Epoxys are much more chemically resistant to being dissolved. Also, keep in mind the less glue you use (conversely the more of the surface you can coat with thermal compound) the easier time you will have reusing the components.

....my 2 cents worth....

-overworked-