HotHardware continue their IDF coverage today with a look inside keynote talks from Gordon Moore and Pat Gelsinger.
Pat next focused on Intel's current and future I/O innovations. He talked about the Tulapi SOC (System on a Chip) accelerator and then spoke of USB 3.0. According to Pat, USB 3.0 will offer a 10X increase in performance over USB 2.0 and will use both copper and optical interconnects. He also held up a couple of pro-type USB 3.0 cables to show the room what they looked like.IDF Day 1 Coverage: More Keynotes, X38 Skulltrail, PCI Express 3.0 And 32nm
