In a letter Intel sent to its channel partners on the 18th of January (see link below), the firm said that because of tightness in supplies, and a rapid move from Slot 1 (SECC2) packaging to flip-chip (FC-PGA) packaging, it was recommending the use of slot-to-socket adaptors.

Indeed, earlier this year, there were strong indications from some of Intel´s PC manufacturer customers that it could offer its own workaround device, to make up for the gap in mobo support.

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