DeviantPC has posted an overview of the upcoming processor technology 'Silicon On Insulator' or more commonly known as SOI

Thanks go to IBM again for solving this one. They used a technique called SIMOX (Seperation by Implantation of Oxygen) to create an insulating layer of Silicon Oxide on top of the silicon wafer. By injecting Oxygen at high pressure on to the Silicon wafer at high temperature the Silicon reacts with the Oxygen to form a layer of Silicon Oxide - bonded to the Silicon layer below.

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