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VIA Platform Solutions Division Introduces Ultra Compact VIA EPIA Mini-ITX Mainboard

Taipei, Taiwan, 3rd April 2002 - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced the worldwide availability of its ultra-compact, highly-integrated EPIA Mini-ITX mainboard through the VIA Platform Solutions Division (VPSD).

Offering the choice of a VIA Eden:tm: ESP processor for fanless systems with power sensitive requirements, or a VIA C3:tm: E-Series processor for more multimedia rich applications, the highly integrated VIA EPIA Mini-ITX mainboard features integrated 3D graphics, AC’97 audio, Ethernet and TV-Out connectivity. Measuring only 170mm x 170mm, it is the perfect platform for developing the next generation of small footprint Digital Information Appliances and Entertainment Devices.

With an operating voltage of only 1.2V, the recently launched VIA Eden ESP processor expands on the acclaimed low-power consumption and heat dissipation qualities of the VIA C3:tm: processor, offering lower power consumption than any other x86 processor on the market today. Furthermore, the VIA Eden ESP processor does not require a fan, opening up endless possibilities in the design of silent PCs and other quiet running devices.

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